DSD 2022 – MCSDIA

Mixed-Criticality System Design, Implementation and Analysis (MCSDIA)

Special Session Scope

he Euromicro Conference on Digital System Design (DSD) addresses all aspects of (embedded, pervasive and high-performance) digital and mixed HW/SW system engineering, covering the whole design trajectory from system specification down to micro-architectures, digital circuits and VLSI implementations.

Modern embedded appliances already integrate a multitude of functionalities with potentially different criticality levels into a single system and this trend is expected to grow in the near future. The integration of multiple functions with different criticality and certification assurance levels on a shared computing platform constitutes a mixed-criticality system (MCS). Mixed-criticality systems range from lowest assurance requirements up to the highest criticality levels. In many domains such as automotive, avionics and industrial control, the economic success depends on the ability to design, implement, qualify and certify advanced real-time embedded systems within bounded time, effort and costs. Without appropriate preconditions, the integration of mixed-criticality subsystems can lead to a significant and potentially unacceptable increase of engineering and certification costs.

Topics of interest include, but are not limited to, the following:

  • Predictable and composable multicore platform (including COTS and state-of-the-art MPSoC-GPU chips) resource management
  • Mechanisms for temporal and spatial partitioning, including physical resource virtualization for temporal and spatial segregation and resources partitioning techniques at chip and cluster level to achieve composability in multiple dimensions (time, power, temperature)
  • Solutions for communication resource partitioning and virtualization on- and off-chip
  • Dynamic resource management for mixed-criticality systems
  • Reliability and energy integrity of services for mixed-criticality systems, health monitoring
  • Dependable operation of battery-driven/mobile mixed-criticality systems
  • Requirements engineering and traceability for mixed-criticality systems
  • Multi-physical component- and model-based design techniques
  • Composable analysis of extra-functional properties (like timing, power, temperature, safety and security) & certification techniques
  • (Incremental) verification of extra-functional properties
  • Modular safety cases
  • Modular Online Updates
  • Design-space exploration for multi-physical mixed-criticality systems
  • Industrial case-studies and best practice

Submission Guidelines

Authors are encouraged to submit their manuscripts via EasyChair web service at web page https://easychair.org/conferences/?conf=dsd2021. Each manuscript should include the complete paper text, all illustrations, and references. The manuscript should conform to the IEEE format: single-spaced, double column, US letter page size, 10-point size Times Roman font, up to 8 pages. In order to conduct a blind review, no indication of the authors’ names should appear in the manuscript, references included.

Special Session Chair

Kim Grüttner (OFFIS, DE) – chair

Eugenio Villar (U Cantabria, ES) – co-chair

Special Session Program Committee

  • Mikel Azkarate-askatsua (IK4-IKERLAN, ES)
  • Sanjoy Baruah (U North Carolina, USA)
  • Gedare Bloom (George Washington U, USA)
  • Francisco J. Cazorla (BSC & IIIA-CSIC, ES)
  • Alfons Crespo (UPV & FentISS, ES)
  • William Fornaciari (Politecnico di Milano, IT)
  • Kees Goossens (TU/e, NL)
  • Kim Grüttner (OFFIS, DE)
  • Philipp A. Hartmann (Intel, DE)
  • Xabier Iturbe (ARM. GB)
  • Renato Mancuso (Boston University, USA)
  • Silvia Mazzini (INTECS, IT)
  • Julio Medina (U Cantabria, ES)
  • Roman Obermaisser (U Siegen, DE)
  • Michael Paulitsch (Intel, DE)
  • Ingo Sander (KTH, SE)
  • Andreas von Schwerin (Siemens, DE)
  • Ingo Stierand (OFFIS, DE)
  • Jean-Loup Terraillon (ESA, NL)
  • Sascha Uhrig (Airbus, DE)
  • Heechul Yun (University of Kansas, USA)

Contact Information

Kim Grüttner 
e-mail: